New, High Purity, Alumina based adhesive incorporates a unique, catalytic curing system.
Just mix the adhesive and it's activator to form a readily dispensable, smooth, creamy paste.
It will not clog delicate dispensing needles and is suitable for any application requiring micro drops or several ounces of material.
Resbond 908 has excellent electrical resistance, moisture resistance and thermal conductivity.
Resbond 908 will become water insoluble after use (or post cure) at temperatures of 250ºF - 300ºF.
908 Successfully filled a long tubular probe, providing long term electrical isolation and moisture proofing for a electronic sensor.
Applications include bonding, potting and encapsulating delicate electronic assembles, sensors, instruments and general purpose high temp. applications.
It will satisfy many difficult application requirements and is ideal for many critical, electronic applications.
Resbond 903HP is an ultra high temperature, Alumina Adhesive.
Developed for high strength bonding of any combination of dense non-porous ceramics, glass and or non-reactive metals.
Resbond 903HP is a smooth, creamy paste that can be brushed, troweled or sprayed on.
Just re-mix and apply.
Handling strength is obtained, after an initial cure at 250ºF. A complete cure occurs in 1 hour at 600-700ºF.
Resbond 903HP is usable to 3250ºF continuously.
It has excellent resistant to liquid metals, oxidizing and reducing atmospheres, most chemicals and solvents.
Resbond 903HP has excellent electrical properties.
903HP bonds thermocouples to high alloy steel and withstands repeated thermal cycling from -100ºF to 500ºF.
903HP was easily sprayed onto stainless steel to form a dielectric layer for an industrial heater, used at 1400ºF.