Electrically resistant - Thermally Conductive Adhesives
New, High Purity, Alumina based adhesive incorporates a unique, catalytic curing system.
Just mix the adhesive and it's activator to form a readily dispensable, smooth, creamy paste.
It will not clog delicate dispensing needles and is suitable for any application requiring micro drops or several ounces of material.
Resbond 908 has excellent electrical resistance, moisture resistance and thermal conductivity.
Resbond 908 will become water insoluble after use (or post cure) at temperatures of 250ºF - 300ºF.
908 Successfully filled a long tubular probe, providing long term electrical isolation and moisture proofing for a electronic sensor.
Applications include bonding, potting and encapsulating delicate electronic assembles, sensors, instruments and general purpose high temp. applications.
It will satisfy many difficult application requirements and is ideal for many critical, electronic applications.
Resbond 903HP is an ultra high temperature, Alumina Adhesive.
Developed for high strength bonding of any combination of dense non-porous ceramics, glass and or non-reactive metals.
Resbond 903HP is a smooth, creamy paste that can be brushed, troweled or sprayed on.
Just re-mix and apply.
Handling strength is obtained, after an initial cure at 250ºF. A complete cure occurs in 1 hour at 600-700ºF.
Resbond 903HP is usable to 3250ºF continuously.
It has excellent resistant to liquid metals, oxidizing and reducing atmospheres, most chemicals and solvents.
Resbond 903HP has excellent electrical properties.
903HP bonds thermocouples to high alloy steel and withstands repeated thermal cycling from -100ºF to 500ºF.
903HP was easily sprayed onto stainless steel to form a dielectric layer for an industrial heater, used at 1400ºF.
Duralco 128 is ceramic based adhesive and good to use for applications upto 500ºF. Duralco 128 is thermally conductive and electrically resistant. It is applicable to Metals, Ceramics, Glass, Plastics, as an adhesive and its potting compound. It is easy to use. Just mix the resin and hardener as to given ration but min. more than 30grams, and just apply and cure. Normally it is cured at room temperature but can be accelerated cure with mild heat.
Duralco 132 is an Aluminum Metal filled Epoxy adhesive. It profvides maximum heat transfer available in a 500ºF Epoxy system. It bonds copper coils to vessels for rapid heating and cooling in a critical chemical process. Used for bonding, assembling and heat tacking applications. Duralco 132 is cured at room temperature and forming machinable, thermally conductive bond lines. And, it can be supplied as a non-sag putty for heat tracing applications under the item no. Duralco 132P
Duralco 133 is a two component, heat curing, aluminum filled, conductive epoxy suitable applications up to 600°F. Duralco 133 is combined excellent properties of Duralco 132 with Cotronics higher temp epoxy systems specialties. It is cured with mild heat to form thermally conductive bondlines and heat transfer medium. Duralco 133 is suitable for high temperature tooling. It is readily machinable result and it is ideal for all kinds of repairs and construction.
Material selection is upon user's own decision and the following technical Data is only for refference.